{"id":22058,"date":"2026-06-18T16:42:27","date_gmt":"2026-06-18T08:42:27","guid":{"rendered":"https:\/\/www.elepcb.com\/?p=22058"},"modified":"2026-06-18T16:42:27","modified_gmt":"2026-06-18T08:42:27","slug":"pcb-caf-failure","status":"publish","type":"post","link":"https:\/\/www.elepcb.com\/hu\/blog\/pcb-caf-failure\/","title":{"rendered":"Conductive Anodic Filament in PCB: Causes &amp; Solutions"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"22058\" class=\"elementor elementor-22058\" data-elementor-post-type=\"post\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-7982388 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"7982388\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-6656b60\" data-id=\"6656b60\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-ace1dd5 elementor-toc--minimized-on-tablet elementor-widget elementor-widget-table-of-contents\" data-id=\"ace1dd5\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;headings_by_tags&quot;:[&quot;h2&quot;,&quot;h3&quot;],&quot;exclude_headings_by_selector&quot;:[],&quot;no_headings_message&quot;:&quot;No headings were found on this page.&quot;,&quot;marker_view&quot;:&quot;numbers&quot;,&quot;minimize_box&quot;:&quot;yes&quot;,&quot;minimized_on&quot;:&quot;tablet&quot;,&quot;hierarchical_view&quot;:&quot;yes&quot;,&quot;min_height&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;min_height_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;min_height_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]}}\" data-widget_type=\"table-of-contents.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-toc__header\">\n\t\t\t\t\t\t<h4 class=\"elementor-toc__header-title\">\n\t\t\t\tTable of Contents\t\t\t<\/h4>\n\t\t\t\t\t\t\t\t\t\t<div class=\"elementor-toc__toggle-button elementor-toc__toggle-button--expand\" role=\"button\" tabindex=\"0\" aria-controls=\"elementor-toc__ace1dd5\" aria-expanded=\"true\" aria-label=\"Open table of contents\"><i aria-hidden=\"true\" class=\"fas fa-chevron-down\"><\/i><\/div>\n\t\t\t\t<div class=\"elementor-toc__toggle-button elementor-toc__toggle-button--collapse\" role=\"button\" tabindex=\"0\" aria-controls=\"elementor-toc__ace1dd5\" aria-expanded=\"true\" aria-label=\"Close table of contents\"><i aria-hidden=\"true\" class=\"fas fa-chevron-up\"><\/i><\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<div id=\"elementor-toc__ace1dd5\" class=\"elementor-toc__body\">\n\t\t\t<div class=\"elementor-toc__spinner-container\">\n\t\t\t\t<i class=\"elementor-toc__spinner eicon-animation-spin eicon-loading\" aria-hidden=\"true\"><\/i>\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-524c8df elementor-widget elementor-widget-text-editor\" data-id=\"524c8df\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnHNLxY0LEKG7iZBsv6jlGze\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn0PoSXS3pCtBKdbd2E69Vuc\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnUw75NA10394ha0C8USYGXb\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnOlsUAIE2dO9lUeG6fa8Quf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnzkrShmBDE6zkNedDj7TTbf\">In the field of<a href=\"https:\/\/www.elepcb.com\/blog\/printed-circuit-board-types-and-their-uses\/\"> Printed Circuit Board (PCB)<\/a> manufacturing and electronics engineering, few failure mechanisms have been as detrimental and deceptively destructive as <strong>Conductive Anodic Filament (CAF).<\/strong> As PCB designs become denser, component sizes decrease, and the operational environment becomes more extreme, the likelihood of CAF-related failures increases.<\/div>\n<div class=\"ace-line ace-line old-record-id-AU1zdzEmvoznO2xcJCpcu27NnZg\">To ensure reliable products for use in <a href=\"https:\/\/www.elepcb.com\/blog\/a-guide-to-aerospace-pcb-assembly\/\">aerospace,<\/a> <a href=\"https:\/\/www.elepcb.com\/applications\/pcbs-for-automotive\/\">automotive<\/a>, <a href=\"https:\/\/www.elepcb.com\/applications\/pcb-for-medical-equipment\/\">medical device<\/a>, and industrial applications, design engineers, quality assurance professionals, and all involved with the manufacture of electronic equipment should be knowledgeable regarding CAF. This detailed resource covers everything you want to know about Conductive Anodic Filaments, how they damage PCBs, <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-test-point\/\">testing methods<\/a> for determining CAF, and most importantly, ways to protect against this destructive mechanism.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-7dfdef4 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"7dfdef4\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-45da8f6\" data-id=\"45da8f6\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-f3b9baa elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"f3b9baa\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-inner-column elementor-element elementor-element-b5a190a\" data-id=\"b5a190a\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-e2be1b2 elementor-widget elementor-widget-heading\" data-id=\"e2be1b2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>What Is Conductive Anodic Filament (CAF)? <\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8360bf4 elementor-widget elementor-widget-text-editor\" data-id=\"8360bf4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnlHBYmd27i1ANXt8JuBJyRh\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-Td2DdYTc9oGZU4xOsN4cDXosnvd\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnC5iDeMhwreAXZuYyZCVA7d\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn6CDZuKC1nJljLQHzqBF8Zf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn4OoLpttRI3FtjluKEuImQh\">CAF has been identified as an electrochemical failure mode for printed circuit boards, in which the migration of metal ions through the <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-knowledge\/pcb-laminate-material-process\/\">laminate substrate<\/a> creates an electrical path between two conductors within the laminate. The primary source of the majority of failures resulting from CAF is the movement of metallic copper ions across the epoxy resin-glass fibers from a plated-through-hole or via.<\/div>\n<div class=\"ace-line ace-line old-record-id-doxcnnP7xxQEBqunukJMG1VuAjV\"><strong>Metallic copper ions<\/strong> create a conductive filament, made up of copper salt, by moving across the glass fiber-epoxy resin boundary of a laminate used to construct a printed wiring board. Therefore, CAF may be considered as a parasitic copper pathway that moves through the internal layers of the laminate of a printed circuit board until it makes contact with two conductors that were designed to be electrically isolated. When these two conductors make contact due to the presence of the parasitic pathway, a <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-short-circuit\/\">short circuit<\/a> occurs and\/or insulation breaks down\uff0c potentially leading to total failure of the printed circuit board.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f4b3001 elementor-widget elementor-widget-image\" data-id=\"f4b3001\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"387\" src=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament.jpg\" class=\"attachment-large size-large wp-image-22061\" alt=\"Conductive Anodic Filament\" srcset=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament.jpg 927w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-300x145.jpg 300w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-768x371.jpg 768w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-18x9.jpg 18w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-55d3efd elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"55d3efd\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-cb77d23\" data-id=\"cb77d23\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-3494c57 elementor-widget elementor-widget-heading\" data-id=\"3494c57\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Process for Creating CAF Filaments <\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3864b59 elementor-widget elementor-widget-text-editor\" data-id=\"3864b59\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnmy7PUshIgQ47uUtLpsTEVg\">\n<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnlHBYmd27i1ANXt8JuBJyRh\">\n<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnmy7PUshIgQ47uUtLpsTEVg\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnYtJ4lrhywTPWTtUfvN2eUb\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnwv3ze2CwWCnnB1YyIMyGTh\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnSEEsPKCRu0tEwFgK0JR6Oh\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnD10gsf0aqF9abK7F6uKZ8D\">The formation process for filaments caused by CAF is electrochemical in nature. As a result, three requirements must be met at the same time before the onset of filament formation:<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e379b12 elementor-widget elementor-widget-text-editor\" data-id=\"e379b12\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcn8CXZxFxKwmWqSsgYS5OZuh\"><strong>1. An Applied Bias Voltage (An <\/strong><strong>Electric Field<\/strong><strong>)<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnk4Z37KR6s5bf7Psf7IXLtb\">A bias voltage is necessary when forming filaments using the CAF failure mode. This means that there must exist an applied voltage on two conductor elements that are close enough to each other so as to allow for copper ion migration.<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8719dcb elementor-widget elementor-widget-text-editor\" data-id=\"8719dcb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnRh3z8WwECn2bXOMq08Sggh\"><strong>2. Presence of Moisture<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn23WWfj7Piqy0vdCfbm1Tke\">Water or humidity absorbed into the laminate acts as an electrolyte, allowing ionic conduction within the substrate. Without the presence of <a href=\"https:\/\/www.elepcb.com\/blog\/moisture-sensitive-device\/\">moisture,<\/a> propagation of CAF cannot occur. Thus why CAF is so much more likely to occur in high-humidity operating environments and sealed enclosures undergoing thermal cycling.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0dde182 elementor-widget elementor-widget-text-editor\" data-id=\"0dde182\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcndPhVcwlx9daKLWYWEr5jre\"><strong>3. A Pathway for Copper Ion Migration<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnVWNFVWtbGbK3q1x5mqSFkf\">The glass fiber-epoxy resin interface must provide a pathway with low resistance. When the adhesion bond strength between the glass fibers and epoxy resin deteriorates due to<a href=\"https:\/\/www.elepcb.com\/blog\/pcb-knowledge\/mechanical-stress-in-pcb-coating\/\"> thermal stress<\/a>, mechanical drilling, or absorption of moisture into the laminate, it provides a channel along which copper ions can travel.<\/div>\n<div class=\"ace-line ace-line old-record-id-doxcnRjns8IvBew4muT2h5DmTQd\">As soon as these three conditions align, the oxidized and dissolved copper at the positively charged conductor (the anode) travels along the compromised glass fiber interface toward the negatively charged conductor (cathode), where they are reduced and deposited as solid copper. Over time, the deposited copper continues to grow, forming a filamentary bridge, a Conductive Anodic Filament, that may reduce insulation resistance to dangerously low levels.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6a2b556 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6a2b556\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-807a97d\" data-id=\"807a97d\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-53a7843 elementor-widget elementor-widget-image\" data-id=\"53a7843\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"800\" height=\"590\" src=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Copper-Ion-Migration-1024x755.jpg\" class=\"attachment-large size-large wp-image-22062\" alt=\"Copper Ion Migration\" srcset=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Copper-Ion-Migration-1024x755.jpg 1024w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Copper-Ion-Migration-300x221.jpg 300w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Copper-Ion-Migration-768x566.jpg 768w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Copper-Ion-Migration-16x12.jpg 16w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Copper-Ion-Migration.jpg 1280w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a99320d elementor-widget elementor-widget-heading\" data-id=\"a99320d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>How Does CAF Affect PCB Performance?<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-47daee1 elementor-widget elementor-widget-text-editor\" data-id=\"47daee1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnZ5p0z9x3rFftCO2tjDRiGg\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn5kb0QN4eABCOPuAjDnlPee\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-GOZDdwtL4oGjARx7FgvcuZwanQd\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnUYXTW9o8o64dZ2Rrdl82Uf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnC37L4Hq3VFAAAyCbgbvoCe\">Understanding how CAF affects PCB performance depends on how this failure mechanism affects the overall reliability of your electronics. CAF rarely causes catastrophic, sudden system failure. Instead, it tends to be a slow-degrading fault mechanism. The effects of CAF may show up after you have put the product into service in the field.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-918fe69 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"918fe69\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-inner-column elementor-element elementor-element-e459bcd\" data-id=\"e459bcd\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-66db167 elementor-widget elementor-widget-text-editor\" data-id=\"66db167\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcn9m8UmSTXRHmv5B95ugj6Ph\"><strong>1. Deterioration in Surface Insulation Resistance between Affected Conductor Paths<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnmu8RYaqM8JMa236D3LLMMe\">Probably the first and most quantifiable sign of CAF\u2019s degradation is its significant reduction in the surface insulation resistance (SIR) between any two conductor paths that are influenced by the CAF filament(s).<\/div>\n<div class=\"ace-line ace-line old-record-id-P1cZdqV6koQKDAxdbcRcyGVznze\">Most \u201chealthy\u201d PCB laminates have SIR levels greater than <strong><span style=\"color: #008000;\">10^9 Ohm<\/span>.<\/strong> When a CAF filament has developed and grown sufficiently to bridge two conductor paths, the SIR drops rapidly by multiple orders of magnitude. As a result, an unintended path of current exists between two previously insulated conductor paths, creating unwanted electrical phenomena such as unexplained signal behavior and\/or other intermittent problems.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-652567c elementor-widget elementor-widget-text-editor\" data-id=\"652567c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnZWxkYQMA99VFPqm6qvd1yg\"><strong>2. Shorts and Failure Due to Electrical Overload<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcna4VEBQggrux9zpUNmjaWCg\">Once a completely developed CAF filament connects two conductor paths together, they essentially become electrically connected; thus, a short circuit is created. Depending upon the voltage level of the application, shorts can lead to thermal runaways and fires in the case of <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-knowledge\/high-voltage-circuit-board-hv-pcb-solution\/\">high-voltage applications<\/a>. In addition, shorts can also create power surges, component overheating, etc. In low-power, low-voltage applications (i.e., digital <a href=\"https:\/\/www.elepcb.com\/blog\/integrated-circuit\/\">ICs<\/a>), even partial shorts caused by CAF filaments can create problems such as spurious logic states and\/or data transmission errors.<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-257b082 elementor-widget elementor-widget-text-editor\" data-id=\"257b082\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnubupCxJ36IRg6eifEJjeAg\"><strong>3. Intermittent Field Failure<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnPTvqTRzCTeQzVDIqfTOvHe\">Another problem with CAF-related failures is that they tend to act in an intermittent manner. Due to the sensitivity of CAF development to environmental conditions such as moisture content and temperature, a PCB may appear to function perfectly well under laboratory test conditions yet begin to fail randomly while operating in the field under fluctuating environmental conditions.<\/div>\n<div class=\"ace-line ace-line old-record-id-DceMdzQwgonhTnx4zOXca5Dengd\">Thus, diagnosis and correction of these types of failures can be time-consuming and costly; further, diagnostic efforts may result in replacing components unnecessarily or redesigning entire printed wiring boards.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-9800ac2 elementor-widget elementor-widget-text-editor\" data-id=\"9800ac2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnOrlwtuzAnsB5rQbbIYktrh\"><strong>4. Reducing System Life Expectancy<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnwJXDGA8g5yhNNKLgWMALRe\">CAF&#8217;s ability to form a path for electrical conduction can significantly shorten the life expectancy of a PCB designed for extended service periods. For example, PCBs used in applications requiring ten to twenty years of service are highly susceptible to CAF because of increased susceptibility to moisture absorption and subsequent loss of laminate bond strength during thermal cycles.<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-ace2da1 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"ace2da1\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-95120ad\" data-id=\"95120ad\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-338c75a elementor-widget elementor-widget-heading\" data-id=\"338c75a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>CAF Testing Process: How to Detect and Evaluate CAF Risk<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-d91a6a8 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"d91a6a8\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-inner-column elementor-element elementor-element-06cf859\" data-id=\"06cf859\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5b813bb elementor-widget elementor-widget-text-editor\" data-id=\"5b813bb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnFhe24V3Pd2IfI61ATqRcKc\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-KncBdFZGzoIfi8xCcpAcDHwOnqb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnIoEd0ydgAO2oab1gVSD1Yd\">Electronics manufacturing and quality control have developed many testing methods to measure how well Printed Circuit Board (PCB) laminates and final assemblies resist Conductive Anodic Filament (CAF) growth. As a result of these testing procedures, manufacturers are able to determine if their designs and\/or materials will likely be at risk for CAF growth prior to reaching their end-users.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-bd15c59 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"bd15c59\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-c117c50\" data-id=\"c117c50\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-ed49207 elementor-widget elementor-widget-heading\" data-id=\"ed49207\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Applications of High-speed PCBs<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-a3729f9 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"a3729f9\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-inner-column elementor-element elementor-element-05afa55\" data-id=\"05afa55\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-54dfb77 elementor-widget elementor-widget-text-editor\" data-id=\"54dfb77\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-TOtrdayFpokgKtxJvnCcJAccn3b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnScbMp4wLMxihPq6wAE4ZMc\"><strong>IPC-TM-650 Method 2.6.25: CAF Testing\u2019s Standardized Methodology<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn81O5XslWsHIBhtklHXacve\">The most common standardized testing procedure for assessing a material&#8217;s ability to resist CAF growth is found in <strong>IPC-TM-650, Test Method 2.6.25.<\/strong> Developed by IPC, the global trade association for the electronic interconnect manufacturing supply chain, this test method assesses a PCB laminate&#8217;s resistance to CAF growth based upon its Insulation Resistance (IR), which is evaluated during the application of a bias voltage under elevated temperature and humid conditions.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-34eda5a elementor-widget elementor-widget-text-editor\" data-id=\"34eda5a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-TOtrdayFpokgKtxJvnCcJAccn3b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnRib3LzAuUiBmcb1Z2hQhHf\"><strong>Application of Stress Conditions<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnoG5Gz95dDT7n0gsYb0b8sb\">After thermal preconditioning, conditioned specimens are placed inside a temperature and humidity-controlled chamber where they are exposed to simulated aging conditions. The standard test conditions specified in the IPC-TM-650 include:<\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-doxcnV1A0sROWGEiiEuG2G33b9f\" data-list=\"bullet\">\n<div>Temperature: 85 \u00b0C<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnDEom0pkfqECLZ2mr9tqvvs\" data-list=\"bullet\">\n<div>Relative Humidity: 85 % RH<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcn2aIM4Db0fc0AR1kdmy6ese\" data-list=\"bullet\">\n<div>Bias Applied DC Voltage: 100 V DC (or the application-specific voltage)<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcn5N9egMWZk3gIulrBgN36Gh\" data-list=\"bullet\">\n<div>Duration of Stress Exposure: 500 hours minimum (longer tests may continue longer than 1,000 hours)<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cf6be11 elementor-widget elementor-widget-text-editor\" data-id=\"cf6be11\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnio7Gj36wNzWHS1COUdqE5g\" style=\"text-align: center;\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnTxuSs0jRNU2lQU0847KAib\" style=\"text-align: left;\"><strong>SEM<\/strong><strong> and Cross-Sectional Analysis<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnbyWEAWowQz5nlUA4cqUvAe\" style=\"text-align: left;\">Failed or suspect specimens that were subjected to accelerated stress testing are examined using <strong>Scanning Electron Microscopy (SEM)<\/strong> and cross-sectional metallography techniques to visually verify both the existence and morphology of CAF filaments. Using SEM allows engineers to directly observe copper filament growth along glass fiber-resin interfaces and visualize the complete failure path of CAF-related failures.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-06556d8 elementor-widget elementor-widget-text-editor\" data-id=\"06556d8\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnio7Gj36wNzWHS1COUdqE5g\" style=\"text-align: center;\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnUk5c44lUHfDWOVnTbB09Wd\" style=\"text-align: left;\"><strong>EDS<\/strong><strong>\/<\/strong><strong>EDX<\/strong><strong> Elemental Analysis<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn3C53EYkykfjkjoUC1usp4d\" style=\"text-align: left;\">In addition to SEM analysis, <strong>Energy Dispersive <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-x-ray-inspection\/\">X-ray<\/a> spectroscopy (EDS or EDX)<\/strong> can be utilized for elemental analysis of suspected CAF deposits. EDS analysis will provide confirmation that copper exists within the identified filamentary growth and distinguish it from other types of contaminants or failure mechanisms, such as Ionic Contamination or Electrochemical Migration on the board surface.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-inner-column elementor-element elementor-element-b107a10\" data-id=\"b107a10\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a81a51c elementor-widget elementor-widget-text-editor\" data-id=\"a81a51c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-TOtrdayFpokgKtxJvnCcJAccn3b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnYigFPKaUXZKrtV8hrxaVWf\"><strong>Specimen Preparation<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnQHXiNHr7kikXtXRWlptIVf\">Typically, specimens used for evaluating CAF growth according to the IPC-TM-650 specifications are PCB coupons with a &#8220;comb&#8221; pattern; these have via-to-via spacings that best represent worst-case design scenarios.<\/div>\n<div class=\"ace-line ace-line old-record-id-doxcnQHXiNHr7kikXtXRWlptIVf\">Some typical spacings tested according to the IPC-TM-650 specifications include<em> 0.5 mm,<\/em> <em>0.625 mm, 0.8 mm, and 1.0 mm<\/em> center-to-center spacings of vias, representative of high-density and ultra-high-density design layouts.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4313990 elementor-widget elementor-widget-text-editor\" data-id=\"4313990\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-TOtrdayFpokgKtxJvnCcJAccn3b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcn4XAFUKlF8y49nJ2dmBcKwg\"><strong>Pre-conditioning<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnq39XtjoMH9qFiKLH0qlyYg\">Before applying stress conditions to test specimens, specimens are thermally preconditioned to mimic the stresses associated with the PCB manufacturing process.<\/div>\n<div class=\"ace-line ace-line old-record-id-PufSdkx6MoOhBux6noVca0canMd\">Before conducting the CAF stress testing, the specimens undergo thermal preconditioning to introduce delamination and micro-cracks into the laminate structure to better replicate the realistic damage introduced during the manufacture of actual printed circuit boards.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-20c1b54 elementor-widget elementor-widget-text-editor\" data-id=\"20c1b54\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-TOtrdayFpokgKtxJvnCcJAccn3b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcny1BxjvfsCNwT5Ral7YYHod\"><strong>Monitoring IR During Stress Testing<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnMSmWbKYaLZ5PO4Ex0GAjHe\">During all phases of the test duration, IR values are monitored at fixed intervals; usually every 24 to 168 hours, depending on the test methodology. A specimen is considered to have failed due to CAF growth when the IR value decreases to less than a predetermined threshold value, usually <strong>1 \u00d7 10\u2076 ohms (1 MOhm)<\/strong> as defined by the IPC standards.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8d25daa elementor-widget elementor-widget-text-editor\" data-id=\"8d25daa\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnio7Gj36wNzWHS1COUdqE5g\" style=\"text-align: center;\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcn85BfwsNQlcKStaVUIdjCId\" style=\"text-align: left;\"><strong>Statistical Time-to-Failure (TTF) Analysis and Weibull Distribution Models<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn6q91vcycp1Od8F6c6MERwf\" style=\"text-align: left;\">Many advanced CAF testing programs use TTF analysis using Weibull distribution models to extrapolate data obtained from accelerated testing to predict real-world operating lifetimes. Multiple specimens are stressed at multiple different voltage and humidity levels and Weibull Probability Plots are constructed to estimate the likelihood of CAF-related failures occurring at operational conditions and service lives of intended applications.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<div class=\"elementor-element elementor-element-aacb481 elementor-widget elementor-widget-image\" data-id=\"aacb481\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"800\" height=\"598\" src=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-CAF-in-PCBs-1024x766.jpg\" class=\"attachment-large size-large wp-image-22060\" alt=\"Conductive Anodic Filament (CAF) in PCBs\" srcset=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-CAF-in-PCBs-1024x766.jpg 1024w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-CAF-in-PCBs-300x225.jpg 300w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-CAF-in-PCBs-768x575.jpg 768w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-CAF-in-PCBs-16x12.jpg 16w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/06\/Conductive-Anodic-Filament-CAF-in-PCBs.jpg 1280w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-c86a229 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"c86a229\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-e0e02ad\" data-id=\"e0e02ad\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-91a29f0 elementor-widget elementor-widget-spacer\" data-id=\"91a29f0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1b713ed elementor-widget elementor-widget-heading\" data-id=\"1b713ed\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>How to Prevent CAF in PCBs: Design, Material, and Process Strategies<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1540a4d elementor-widget elementor-widget-text-editor\" data-id=\"1540a4d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn1OSAKQa6SeGBNOsmQbaogh\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-CfTXd89ICoHauHxfMOmcUhEEn7b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnaI4vnZLL9JLVv4l4ZdnGsd\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnyCBLLQ0TYBlJRfei6sd3Hf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnIYKxtYEwfuD30pqyoiXHug\">The prevention of CAF (conductive anodic filament) failure represents a multi-faceted problem area encompassing PCB laminate choices, design layouts, manufacturing process control and environmental conditions during assembly. In order to mitigate CAF effectively, it is necessary for engineers to consider all contributors to CAF concurrently; no one strategy will be effective alone.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-51428a7 elementor-widget elementor-widget-text-editor\" data-id=\"51428a7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnfiCxsmvRNK0hGOTp0ILVTc\"><strong>1. Choose a CAF-Resistant PCB Laminate Material<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnvWBcFQS6DcAgIbdLhuxEvf\">The PCB laminate selected by the designer has the largest influence on preventing CAF failures. Not all FR-4 laminate materials are created equal. The adhesion quality of glass fiber-epoxy resin bonding varies widely among laminate grades and suppliers. When designing PCBs that may require any of the following considerations, engineers should select Laminates that have been qualified for CAF resistance according to IPC-tm-650 2.6.25.<\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-Ckjcdn0FcoFxrbxbQ1ccRNJqngj\" data-list=\"bullet\">\n<div>High-layer-count boards (greater than or equal to 8 layers)<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-U7jSd9vkVol3x5xF0hBct0kHnbg\" data-list=\"bullet\">\n<div>Small pitch via structures (less than or equal to 0.8 mm via-to-via spacing)<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-AKyvdzSGNoiprhxij7FcYTXBnVd\" data-list=\"bullet\">\n<div>High-temperature operating environments<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-LQwodRVjmov8vAxiJ5HcjEmXnjh\" data-list=\"bullet\">\n<div>High-humidity operating environments<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-DYe4dQ2YLoBm31xtdBQczXRJnub\" data-list=\"bullet\">\n<div>Extremely long service life requirements (greater than 10 years)<\/div>\n<\/li>\n<\/ul>\n<div class=\"ace-line ace-line old-record-id-doxcn7y8e5m9KOkD67qqrsRBlI9\">Engineers selecting higher performance laminate systems, including low-halogen, high-Tg materials and those designed with better silane coupling agents on the glass fibers, experience fewer CAF failures versus standard grade commercial FR-4 materials. Suppliers of laminate materials, including Isola, Ventec, Panasonic, and other companies, produce CAF-characterized material grades that provide their customers with published test results from IPC-tm-650 testing.<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7a769e6 elementor-widget elementor-widget-text-editor\" data-id=\"7a769e6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnU0o06jm3dqGQIIYVvBvXVd\"><strong>2. Maximize PCB Via<\/strong> <strong>and Through-Hole Spacing<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnQHdrwiAqapjrP2014MkOxh\">Design decisions made in the early stages of the PCB design process directly affect the potential for CAF failures. Design engineers should use the following PCB design techniques to minimize the potential for CAF failures:<\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-Srt6dntflogU93xWd8Ucx7bEnNd\" data-list=\"bullet\">\n<div>Increase via-to-via spacing whenever possible. Increasing the spacing increases the distance that water vapor must migrate to create a pathway for electrical conduction.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-Um2idGoxTo6P4WxKHS3cHCXynkE\" data-list=\"bullet\">\n<div>Avoid placement in a straight line with adjacent high-voltage conductors. Water vapor migrates more easily down straight glass fibers than through other means. Placing vias in an offset pattern prevents this pathway.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-BbandyowLoXqtRxuKwQcSca8n8c\" data-list=\"bullet\">\n<div>Keep high-voltage conductors away from adjacent ground or low-voltage conductors. This is especially important in power electronic applications or applications involving high voltages.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-HxiYdyiXfoxvhIxyRLrcCrk1nAg\" data-list=\"bullet\">\n<div>Place vias in staggered arrays in densely populated areas instead of placing them in a grid array. In grid arrays, multiple holes are often placed so close together that they share the same glass fiber pathways.<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a406b8c elementor-widget elementor-widget-text-editor\" data-id=\"a406b8c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnA65FUwTqFsvYI00PLmeQJc\"><strong>3. Manage the Drilling Process of PCB<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnqChWL6Fv3jUHYkdxmC7V5c\">Drilling of the PCB laminate creates via holes and plated through-holes and is also a major contributor to the potential for CAF failures. Using aggressive drilling settings, i.e., large feed rates, dull drills, and poor chip removal, causes additional mechanical stress at the glass fiber-resin interface, resulting in damaged adhesive bonds that allow CAF failures to occur.<\/div>\n<div class=\"ace-line ace-line old-record-id-Ucn1ddQm1o62PzxPFigcQ5eBnTh\">Process control methods for minimizing drilling-induced CAF include:<\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-doxcnWdlEH3cSl4Nxed4FeMcHrh\" data-list=\"bullet\">\n<div>Using sharp, well-maintained drill bits and limiting hits and stack height based upon the supplier&#8217;s recommendations<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnmctnce7kTcYOrgH4dJHcZD\" data-list=\"bullet\">\n<div>Setting up drill feeds and speeds to minimize heat and mechanical stresses to the laminate<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcn0gfoy61FlvWA4GAwIt4Ril\" data-list=\"bullet\">\n<div>Utilize back-up and entrance materials that minimize fiber breakage at hole entrances and exits<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnZbeQ2X1b20ZU2VqjsNzjAh\" data-list=\"bullet\">\n<div>Periodically inspect drilled holes utilizing microsections.<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-52b16c7 elementor-widget elementor-widget-text-editor\" data-id=\"52b16c7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnMGwwJfCtBnOPUNpWEBGJ3g\"><strong>4. Maintain Strict Moisture Controls during Manufacturing<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcni3b52QbI3XWQynDfprQ2Lc\">\n<div>\n<div>Moisture is an essential component in enabling CAF growth. Controlling moisture exposure during PCB manufacture and assembly is an important method of CAF prevention:<\/div>\n<div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-BTwJdMZr0oVxWKxqLx0cTnzunMf\" data-list=\"bullet\">\n<div>Dry bare PCB laminates and finished assemblies before mounting components to remove absorbed moisture, particularly after extended storage periods in humid environments<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-BZfrdQx0Boe8Ytxr7nTcwv8dn2b\" data-list=\"bullet\">\n<div>Maintain storage of bare PCBs and laminate supplies in low-humidity environments (preferably &lt; 40% relative humidity).<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-D2lFdL2LOowr5FxOtQucLKegnEc\" data-list=\"bullet\">\n<div>Comply with IPC-1601 guidelines regarding handling and storing bare PCBs to limit moisture absorption before and during mounting of components;<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-UGWKdZsJzoB1t5xuOWccyV8XnEh\" data-list=\"bullet\">\n<div>Provide proper ventilation and temperature Control in work areas to preclude the formation of moisture on board surfaces due to thermal cycling operations.<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f5662bd elementor-widget elementor-widget-text-editor\" data-id=\"f5662bd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnjLCYv6SZZevmXnuSJzVZob\"><strong>5. Utilize Conformal Coatings for Field Protection<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnlReJLgeHnsYLc5NM4oDFNc\">In addition to being beneficial for protecting against other forms of environmental degradation, applying a conformal coating over a PCB intended for severe field exposures, e.g., outdoors, automotive underhood applications, marine electronics, or industrial environments exposed to extreme humidity, will provide a physical barrier to moisture entering the PCB laminate and thus greatly decrease the moisture-driven electrochemical reactions that facilitate CAF growth. Conformal coatings such as acrylic, silicones, urethanes, or epoxies may be applied according to IPC-cc-830 standards for moisture reduction in PCBs subjected to field exposure.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1728ae5 elementor-widget elementor-widget-text-editor\" data-id=\"1728ae5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcn0cjveoGlC4Ozm2vLbvgaKd\"><strong>6. Design for Voltage Stress Management<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn4f87YWmHK2601e79DICWkf\">\n<div>\n<div>Another effective way to prevent CAF is to decrease the electrical driving force behind CAF. High voltage differences between two conductors placed close together are a common occurrence in circuits. The designer can use the following methods to mitigate this problem:<\/div>\n<div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-doxcnwFOVeoba7EHhLRVH0P9HmQ\" data-list=\"bullet\">\n<div>Add guard rings or guard traces at ground potential between two high-voltage conductors to lower the effective electric field over the dielectric gap.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnhtxNU4T6xyoRLCTX9yN1th\" data-list=\"bullet\">\n<div>Utilize DRC software, which has built-in CAF-aware clearance rules to alert designers when there are two high-voltage conductors that do not have enough space based on the laminate CAF specification.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnU2vA8OozqiVY0tyRTinG7d\" data-list=\"bullet\">\n<div>Use voltage distribution maps during the<a href=\"https:\/\/www.elepcb.com\/pcb-layout-design-process-and-guidelines\/\"> PCB layout<\/a> phase to determine and revise critical design elements between two adjacent high-voltage conductors prior to finalizing a PCB for manufacturing.<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-751f995 elementor-widget elementor-widget-text-editor\" data-id=\"751f995\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-4 ace-line old-record-id-doxcnSZfVGFtYfjm8S6FqdwlI4e\"><strong>7. Evaluate PCB Manufacturers with CAF-Specific Testing<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnLzyevivIOQACoIShFmgnXf\">\n<div>\n<div>Regardless of how well a printed board laminate material is designed to resist CAF, poor fabrication process control can still compromise its ability to withstand CAF. Therefore, both original equipment manufacturers (OEMs) and contract manufacturers need to include CAF-related qualification requirements as part of their PCB fabricator qualification processes. These requirements may include:<\/div>\n<div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-doxcnxP6vJyJdY3axGXGDXhTrkb\" data-list=\"bullet\">\n<div>A review of the fabricator&#8217;s documentation related to the drilling process.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnDSjMO6eNCyuXPq9IUDkWBe\" data-list=\"bullet\">\n<div>Documentation showing that the fabricator has completed IPC-TM-650 2.6.25 CAF testing on process qualification coupons.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcn4WgzeA9kQFIklyHvFy9T2d\" data-list=\"bullet\">\n<div>Documentation showing traceability from each laminate material lot number to CAF-qualified material specifications.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-doxcnscq5eyJcjF1JSKFhWjyPFh\" data-list=\"bullet\">\n<div>Documentation demonstrating Cpk results on key process factors affecting laminate integrity.<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-940edb8 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"940edb8\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-50886fb\" data-id=\"50886fb\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-f182f22 elementor-widget elementor-widget-heading\" data-id=\"f182f22\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Conclusion<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e415500 elementor-widget elementor-widget-text-editor\" data-id=\"e415500\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnH052Xla1jTt65zV5oyJYoe\">Although <strong>conductive anodic filament (CAF)<\/strong> formation has multiple factors contributing to its failure mechanism, there are no easy fixes for this problem. In addition, as printed circuit board (PCB) designers continue to improve their ability to produce higher-density boards with improved performance in extreme environments, the potential for CAF to cause electrical failures will likely increase.<\/div>\n<div class=\"ace-line ace-line old-record-id-JsvKdTDyYodgwhxH1RTcKNxHnBe\">However, undersanding the causes of this failure helps prevent and resolve it. If the correct combination of CAF-resistant laminates, suitable PCB layouts, rigorous fabrication control procedures and test protocols based on recognised industry standards (e.g. IPC) are used, alongside effective moisture management methods during manufacturing and storage, the risk of CAF-related failures can be significantly reduced.<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-51779fbb elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"51779fbb\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7acf56f\" data-id=\"7acf56f\" data-element_type=\"column\" 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production, increasing speed to market by 20%.<\/p><p>\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Contact us below to start discussing your project with our Technical Experts today.<\/p><p>\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Whether you already have Gerber Files, submit a\u00a0Quick Quote\u00a0for free estimate.<\/p><\/div><\/form><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5782c747 elementor-button-align-center elementor-widget elementor-widget-form\" data-id=\"5782c747\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;step_next_label&quot;:&quot;Next&quot;,&quot;step_previous_label&quot;:&quot;Previous&quot;,&quot;button_width&quot;:&quot;100&quot;,&quot;step_type&quot;:&quot;number_text&quot;,&quot;step_icon_shape&quot;:&quot;circle&quot;}\" data-widget_type=\"form.default\">\n\t\t\t\t<div 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elementor-field-textual\">\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-email elementor-field-group elementor-column elementor-field-group-message elementor-col-50\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-message\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tEmail Address\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<input size=\"1\" type=\"email\" name=\"form_fields[message]\" id=\"form-field-message\" class=\"elementor-field elementor-size-sm  elementor-field-textual\">\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-tel elementor-field-group elementor-column elementor-field-group-field_373bda7 elementor-col-50\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_373bda7\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tPhone Number\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t\t\t<input size=\"1\" type=\"tel\" name=\"form_fields[field_373bda7]\" id=\"form-field-field_373bda7\" class=\"elementor-field elementor-size-sm  elementor-field-textual\" pattern=\"[0-9()#&amp;+*-=.]+\" title=\"Csak a sz\u00e1mok \u00e9s telefonkarakterek (#, -, * stb.) fogadhat\u00f3k el.\">\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-checkbox elementor-field-group elementor-column elementor-field-group-field_c168eb1 elementor-col-100\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_c168eb1\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tI am interested in (select all that apply)\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t<div class=\"elementor-field-subgroup  elementor-subgroup-inline\"><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Rigid PCBs\" id=\"form-field-field_c168eb1-0\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-0\">Rigid PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Flexible Printed Circuit Boards\" id=\"form-field-field_c168eb1-1\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-1\">Flexible Printed Circuit Boards<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Flexible Aluminum PCBs\" id=\"form-field-field_c168eb1-2\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-2\">Flexible Aluminum PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Flexible PCB Microcircuits\" id=\"form-field-field_c168eb1-3\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-3\">Flexible PCB Microcircuits<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Ultra-Thin Flexible PCBs\" id=\"form-field-field_c168eb1-4\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-4\">Ultra-Thin Flexible PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Rigid-Flex\" id=\"form-field-field_c168eb1-5\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-5\">Rigid-Flex<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Ceramic Printed Circuit Boards\" id=\"form-field-field_c168eb1-6\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-6\">Ceramic Printed Circuit Boards<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Aluminum Printed Circuit Boards\" id=\"form-field-field_c168eb1-7\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-7\">Aluminum Printed Circuit Boards<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Copper Core\" id=\"form-field-field_c168eb1-8\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-8\">Copper Core<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"IC Substrates &amp; Interposer\" id=\"form-field-field_c168eb1-9\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-9\">IC Substrates & Interposer<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"High TG PCBs\" id=\"form-field-field_c168eb1-10\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-10\">High TG PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Heavy Copper\" id=\"form-field-field_c168eb1-11\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-11\">Heavy Copper<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"PCB Assembly\" id=\"form-field-field_c168eb1-12\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-12\">PCB Assembly<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Components Sourcing\" id=\"form-field-field_c168eb1-13\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-13\">Components Sourcing<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Other\" id=\"form-field-field_c168eb1-14\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-14\">Other<\/label><\/span><\/div>\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-upload elementor-field-group elementor-column elementor-field-group-field_2cea676 elementor-col-100\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_2cea676\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tUpload Your Files (Optional)\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t\t\t<input type=\"file\" name=\"form_fields[field_2cea676]\" id=\"form-field-field_2cea676\" class=\"elementor-field elementor-size-sm  elementor-upload-field\">\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-textarea elementor-field-group elementor-column elementor-field-group-field_9ceb2c8 elementor-col-100\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_9ceb2c8\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tMessage\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t<textarea class=\"elementor-field-textual elementor-field  elementor-size-sm\" name=\"form_fields[field_9ceb2c8]\" id=\"form-field-field_9ceb2c8\" rows=\"4\"><\/textarea>\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-group elementor-column elementor-field-type-submit elementor-col-100 e-form__buttons\">\n\t\t\t\t\t<button class=\"elementor-button elementor-size-sm\" type=\"submit\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Submit<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/button>\n\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/form>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-inner-column elementor-element elementor-element-123957a9\" data-id=\"123957a9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap\">\n\t\t\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Table of Contents In the field of Printed Circuit Board (PCB) manufacturing and electronics engineering, few failure mechanisms have been as detrimental and deceptively destructive as Conductive Anodic Filament (CAF). As PCB designs become denser, component sizes decrease, and the operational environment becomes more extreme, the likelihood of CAF-related failures increases. To ensure reliable products [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":22063,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[44],"tags":[],"class_list":["post-22058","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog"],"_links":{"self":[{"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/posts\/22058","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/users\/26"}],"replies":[{"embeddable":true,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/comments?post=22058"}],"version-history":[{"count":7,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/posts\/22058\/revisions"}],"predecessor-version":[{"id":22069,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/posts\/22058\/revisions\/22069"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/media\/22063"}],"wp:attachment":[{"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/media?parent=22058"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/categories?post=22058"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.elepcb.com\/hu\/wp-json\/wp\/v2\/tags?post=22058"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}