{"id":22100,"date":"2026-07-17T09:57:03","date_gmt":"2026-07-17T01:57:03","guid":{"rendered":"https:\/\/www.elepcb.com\/?p=22100"},"modified":"2026-07-17T09:57:03","modified_gmt":"2026-07-17T01:57:03","slug":"bga-reballing","status":"publish","type":"post","link":"https:\/\/www.elepcb.com\/it\/blog\/bga-reballing\/","title":{"rendered":"BGA Reballing: Process, Failures &amp; Prevention Guide"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"22100\" class=\"elementor elementor-22100\" data-elementor-post-type=\"post\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-7982388 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"7982388\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-6656b60\" data-id=\"6656b60\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-ace1dd5 elementor-toc--minimized-on-tablet elementor-widget elementor-widget-table-of-contents\" data-id=\"ace1dd5\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;headings_by_tags&quot;:[&quot;h2&quot;,&quot;h3&quot;],&quot;exclude_headings_by_selector&quot;:[],&quot;no_headings_message&quot;:&quot;No headings were found on this page.&quot;,&quot;marker_view&quot;:&quot;numbers&quot;,&quot;minimize_box&quot;:&quot;yes&quot;,&quot;minimized_on&quot;:&quot;tablet&quot;,&quot;hierarchical_view&quot;:&quot;yes&quot;,&quot;min_height&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;min_height_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;min_height_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]}}\" data-widget_type=\"table-of-contents.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-toc__header\">\n\t\t\t\t\t\t<h4 class=\"elementor-toc__header-title\">\n\t\t\t\tTable of Contents\t\t\t<\/h4>\n\t\t\t\t\t\t\t\t\t\t<div class=\"elementor-toc__toggle-button elementor-toc__toggle-button--expand\" role=\"button\" tabindex=\"0\" aria-controls=\"elementor-toc__ace1dd5\" aria-expanded=\"true\" aria-label=\"Tartalomjegyz\u00e9k megnyit\u00e1sa\"><i aria-hidden=\"true\" class=\"fas fa-chevron-down\"><\/i><\/div>\n\t\t\t\t<div class=\"elementor-toc__toggle-button elementor-toc__toggle-button--collapse\" role=\"button\" tabindex=\"0\" aria-controls=\"elementor-toc__ace1dd5\" aria-expanded=\"true\" aria-label=\"Tartalomjegyz\u00e9k bez\u00e1r\u00e1sa\"><i aria-hidden=\"true\" class=\"fas fa-chevron-up\"><\/i><\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<div id=\"elementor-toc__ace1dd5\" class=\"elementor-toc__body\">\n\t\t\t<div class=\"elementor-toc__spinner-container\">\n\t\t\t\t<i class=\"elementor-toc__spinner eicon-animation-spin eicon-loading\" aria-hidden=\"true\"><\/i>\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-524c8df elementor-widget elementor-widget-text-editor\" data-id=\"524c8df\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnHNLxY0LEKG7iZBsv6jlGze\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn0PoSXS3pCtBKdbd2E69Vuc\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnUw75NA10394ha0C8USYGXb\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnOlsUAIE2dO9lUeG6fa8Quf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnzkrShmBDE6zkNedDj7TTbf\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-LSHrd8i9Ro5nGhxpexFcs6QJnuf\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-U0Gsdmv7nolTZsxDv3dckY1inWe\"><strong>BGA packages<\/strong> are widely used in modern electronic devices as they offer high-density interfacing plus better electrical performance. However, <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-knowledge\/bga-electronics-in-pcb\/\">BGA<\/a> components&#8217; hidden solder joints also make them more difficult to inspect and repair when assembly defects or long-term reliability issues arise.<\/div>\n<div class=\"ace-line ace-line old-record-id-X576dKOLBobWbNxzvlrcuWjSnxc\">BGA reballing is used to fix a broken BGA chip rather than replacing it. It&#8217;s widely used not only in laptops and gaming consoles but also in various industrial equipment, allowing the restoration of solder connections and extension of the service life of valuable electronics.<\/div>\n<div class=\"ace-line ace-line old-record-id-FoCxd2dOIo0rekxSsdVcXIhnnQg\">This guide will explain what BGA reballing is, how the process works, when it is necessary, and how manufacturers can reduce BGA-related failures through proper PCB design, <a href=\"https:\/\/www.elepcb.com\/smt-pcb-service\/\">SMT assembly<\/a> control, and inspection methods.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-55d3efd elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"55d3efd\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-cb77d23\" data-id=\"cb77d23\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-3494c57 elementor-widget elementor-widget-heading\" data-id=\"3494c57\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>What is BGA Reballing?<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3864b59 elementor-widget elementor-widget-text-editor\" data-id=\"3864b59\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnmy7PUshIgQ47uUtLpsTEVg\">\n<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnlHBYmd27i1ANXt8JuBJyRh\">\n<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnmy7PUshIgQ47uUtLpsTEVg\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnYtJ4lrhywTPWTtUfvN2eUb\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnwv3ze2CwWCnnB1YyIMyGTh\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnSEEsPKCRu0tEwFgK0JR6Oh\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnD10gsf0aqF9abK7F6uKZ8D\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnOABxKujn9BPpkhrW3eQfed\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnoiFHfCyaAp07Hb6RDVf3Rb\">BGA reballing is the process of removing the faulty, damaged solder connections from a BGA chip, followed by the replacement of solder balls with new ones. The BGA chip is first cleaned, followed by the fixing of new solder balls using a stencil, after which the reflowing of the solder process is performed to connect it with the PCB again.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ab0af5e elementor-widget elementor-widget-text-editor\" data-id=\"ab0af5e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-C4wfdZHsLowbIMxMgOxc4N3wnrf\"><strong>Advantages and Limitations of <\/strong><strong>BGA<\/strong><strong> Reballing<\/strong><\/h3>\n<p>BGA reballing, if carried out in a proper way, can be an effective method of <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-knowledge\/pcb-repair-steps-solve-failures\/\">repairing<\/a> components and can outperform the disadvantages of this technology.<\/p>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-0295fd7 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"0295fd7\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-inner-column elementor-element elementor-element-41bc5af\" data-id=\"41bc5af\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-76eacf4 elementor-widget elementor-widget-text-editor\" data-id=\"76eacf4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-HLnkdfsthoyrJZxAjGtc9R7Rnzr\"><strong>Advantages<\/strong><\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-QE1adAG6hoqMv6xrXLScAeEHneh\" data-list=\"bullet\">\n<div>Returns default chip dissimilarities.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-GoSydx7Ryo3TLgxipyacBdLFnlh\" data-list=\"bullet\">\n<div>Makes repair cheaper.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-QyqYdP3SUoXWVMxukUhczVzinwk\" data-list=\"bullet\">\n<div>Able to prolong the functional period of devices.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-XufudeMzCoAHBExela4cfMJonyg\" data-list=\"bullet\">\n<div>Minimises tech waste.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-I6OldrHWdoi516xTohjcp9OpnHh\" data-list=\"bullet\">\n<div>Compatible with original hardware.<\/div>\n<\/li>\n<\/ul>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-inner-column elementor-element elementor-element-4739cf9\" data-id=\"4739cf9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-de3c4b1 elementor-widget elementor-widget-text-editor\" data-id=\"de3c4b1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-HLnkdfsthoyrJZxAjGtc9R7Rnzr\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-EufBdQbNZoMhAmxI1LfcYmHvn8e\"><strong>Limitations<\/strong><\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-WDJDd3HD2oGmvsxZdMJcjQUqnee\" data-list=\"bullet\">\n<div>It is unable to fix broken silicon.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-EfIld26eRo20RHxkIrvcPXe5ngc\" data-list=\"bullet\">\n<div>Needs costly rework machinery.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-IqRFds24DosooXxqYo0czn6anQl\" data-list=\"bullet\">\n<div>Has to involve experienced specialists only.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-LPsTdWIdXoquo7xqfVFccdrRn8d\" data-list=\"bullet\">\n<div>Misalignment could cause failure.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-XAEadHLcGoZU0RxrhEEcdaATnqf\" data-list=\"bullet\">\n<div>Involves a procedure that takes plenty of time and is complicated technically.<\/div>\n<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<div class=\"elementor-element elementor-element-c0ea57c elementor-widget elementor-widget-spacer\" data-id=\"c0ea57c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-90b9479 elementor-widget elementor-widget-heading\" data-id=\"90b9479\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Step-by-Step BGA Reballing Process<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e379b12 elementor-widget elementor-widget-text-editor\" data-id=\"e379b12\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcneJE5bcfh39Q5hPL5cCHmNb\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnd2rZHUpd9gPSsNeRMkZ4wb\">Before starting the BGA reballing process, the chip and PCB need to be handled with care using special machines to avoid overheating, <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-knowledge\/mechanical-stress-in-pcb-coating\/\">mechanical stress<\/a>, and contamination of the sample.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8719dcb elementor-widget elementor-widget-text-editor\" data-id=\"8719dcb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcn4tjzL76dZXPsDzrssZVDde\"><strong>Removal of the <\/strong><strong>BGA<\/strong><strong> Component<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnsFwKSt4nCu3ELnjdsxaPRa\">The process of heating BGA chips is done using hot-air or infrared rework stations that melt the solder. Once the soldering temperature has been reached, the chip will be picked up by a vacuum tool. Controlling temperatures during this stage helps avoid <a href=\"https:\/\/www.elepcb.com\/blog\/bow-and-twist-of-pcb\/\">warping of the PCB<\/a>, lifting of pads, and breaking of surrounding components.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e67fb18 elementor-widget elementor-widget-text-editor\" data-id=\"e67fb18\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnbBKiARZr0Yx5GvGQStymBh\"><strong>Cleaning the Remaining Solder Balls<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcngOpg1HCmKcHSLKg9SURdLe\">After the component has been removed, the solder remaining on the chip and PCB pads is removed using a soldering iron, solder wick, and flux. Any residue, oxidation, or excess solder is also removed to make sure the surface is clean and smooth. Cleaning of the surfaces helps ensure that strong adhesion and electrical connections are attained during the reballing process.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b52fe1e elementor-widget elementor-widget-text-editor\" data-id=\"b52fe1e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcn9wwNvhp3MCd9njtBTlzXEa\"><strong>Applying Flux and Stencil<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn7b3HrrzoAaDnLe7RMklAIh\">A thin layer of high-quality <a href=\"https:\/\/www.elepcb.com\/blog\/pcba-knowledge\/pcb-flux-cleaning-clean-or-no-clean\/\">flux<\/a> is applied onto the surface of the chip evenly, so as to ensure effective wetting of the solder. A stencil that is designed for the BGA package is aligned precisely with the chip. Proper alignment of the <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-stencil-smt-assembly\/\">stencil<\/a> eliminates the possibility of any damaged pads or wrong connections.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-297c095 elementor-widget elementor-widget-text-editor\" data-id=\"297c095\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnsZcXX9sTKPKQ3IRTWhLbdd\"><strong>Positioning the <\/strong><strong>Solder<\/strong><strong> Balls<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnRHBfn4STCabbogDZx1gz7b\">After the solder balls have been prepared and cleaned, they are placed over the stencil in such a way that each hole gets one ball in it. This step requires care since any of the solder balls can get loose in the process. It is crucial to ensure that all solder balls are in place, since having just one misplaced ball can cause a fatal error in the functioning of the device.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-59c70cd elementor-widget elementor-widget-text-editor\" data-id=\"59c70cd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcn62kdJsez6EJfkxImZ4NyFb\"><strong>Reflowing the New Balls<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnL5QuNJB7R8gzOw5CXOzdSg\">The chip is heated following a controlled temperature profile until the BPA solder balls melt and adhere to the chip pads. During reflowing, surface tension forms equally shaped spherical solder balls. After cooling, the newly attached solder balls are strong enough to be used in the next step of <a href=\"https:\/\/www.elepcb.com\/pcb-assembly-process-and-services\/\">assembly<\/a>.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e28240b elementor-widget elementor-widget-text-editor\" data-id=\"e28240b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnc3ujKdC9gT4bSozHGFMQnf\"><strong>Reinstalling the Component<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnofU1hMP715HjqFjwf3lLcd\">New flux is applied to the PCB pads, and the reballed BGA chip is carefully placed in its position using optical aligning equipment. The assembly is again heated so that solder balls can be melted and fixed permanently on the PCB. Hence, positioning is very critical because a slight misunderstanding can lead to the formation of circuit tracks.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7aa84d6 elementor-widget elementor-widget-text-editor\" data-id=\"7aa84d6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-DBVQdBNuTo1rsIx0Yfucpkp1nFb\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnzeHuzUCr47s7w245N4ewRg\"><strong>Inspection and Testing<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnw1sHujAPgRSHD8a0IBQPof\">After installation has been completed, the newly made assembly undergoes visual assessment, <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-x-ray-inspection\/\">X-ray scanning<\/a>, and electrical tests. X-rays show hidden solder joints formed on the PCB in the process of assembly.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-089f8f3 elementor-widget elementor-widget-image\" data-id=\"089f8f3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"400\" src=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing-1024x512.png\" class=\"attachment-large size-large wp-image-22102\" alt=\"process of bga reballing\" srcset=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing-1024x512.png 1024w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing-300x150.png 300w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing-768x384.png 768w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing-1536x768.png 1536w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing-18x9.png 18w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/process-of-bga-reballing.png 1774w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-7dfdef4 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"7dfdef4\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-45da8f6\" data-id=\"45da8f6\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-f3b9baa elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"f3b9baa\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-inner-column elementor-element elementor-element-b5a190a\" data-id=\"b5a190a\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-e2be1b2 elementor-widget elementor-widget-heading\" data-id=\"e2be1b2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>BGA Reballing vs Chip Replacement <\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8360bf4 elementor-widget elementor-widget-text-editor\" data-id=\"8360bf4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnlHBYmd27i1ANXt8JuBJyRh\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-Td2DdYTc9oGZU4xOsN4cDXosnvd\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnC5iDeMhwreAXZuYyZCVA7d\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn6CDZuKC1nJljLQHzqBF8Zf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn4OoLpttRI3FtjluKEuImQh\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-Pgjkdvk9Oo9Z0JxURcQcrd1bnvc\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-BtK9dvoPdof3vixS1S3cPZtsnch\">BGA reballing is suitable when the chip is functioning normally, but the solder joints are defective. Whether to replace the chip depends on its actual maintenance needs.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d975385 elementor-widget elementor-widget-text-editor\" data-id=\"d975385\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"true\"><div><table class=\"ace-table\" data-ace-table-col-widths=\"243;243;243\"><colgroup> <col width=\"243\" \/> <col width=\"243\" \/> <col width=\"243\" \/><\/colgroup><tbody><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcn8JXm5Pl67LGkGyvl2qyBUe\"><strong>Aspect<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcndyDrKpKiiVFwpaaSVganCe\"><strong>BGA<\/strong><strong> Reballing<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnfMLGfP0OLaJHZnQZionAVc\"><strong>Chip Replacement<\/strong><\/div><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcn7bK0kDB6vJH9nhDfADucfe\"><strong>Use<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcneDsfpIZeAMFgNkycV43iab\">This technique is applied when the chip is working properly and has some problems with the soldering points, which are damaged because of cracks or wear and tear.<\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnCb5GWnnckzmlkVSeZzPWYe\">Used when the chip itself is electrically or physically damaged and cannot be repaired.<\/div><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnfcXkmuqCvtvdVLqEG6WZIb\"><strong>Cost<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnq3dgH0yDrteeeeN3AkIg1f\">Lower expenses for repairing because it is possible to use the old chip again.<\/div><div class=\"ace-line ace-line old-record-id-doxcnaq3wEsGcNLwWGU2hWV2aeh\">\u00a0<\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcntWW8hVWmrcsaIEP8nRKBBg\">Higher expenses because a new chip must be installed.<\/div><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnqhLpDhkKCRkpsDqPKYIIqf\"><strong>Risk<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnSx2ppBdtWJ9qq8VSp8L0Ud\">Moderate danger since the success depends on the correct placement of solder balls.<\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnobd1Pu2UuA8HfOwPsWBnwm\">Higher danger level because of possible compatibility issues, sourcing the original chip, and complexity of installation.<\/div><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnJoKZSPmaR5XjNxZnzvhWZe\"><strong>Repair Time<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnicn56j6vZJXdGv795Ch8Eh\">Faster than usual ways of repairing because the soldering points are fixed only.<\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnqN6I5dkvOdRskMZfyNxjRg\">Usually takes longer due to chip procurement, replacement, and testing.<\/div><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnQed4G3L5I8TiTOCcXsHZmg\"><strong>Reliability<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnRivHj9thecPH8p39dO1emb\">It works well when the old chip is working fine and the reballing is done properly.<\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcne2Fjz31lIQkfolcNEEIPpf\">A longer process due to obtaining and installation.<\/div><\/td><\/tr><tr><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnyZre6RsjcVr8U3GYGMT4zh\"><strong>Best Choice<\/strong><\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnT5UjU874N5QHzihXwulLJe\">The most suitable way of repairing is in case the soldering problems appear because of thermal cycling or mechanical stress.<\/div><\/td><td colspan=\"1\" rowspan=\"1\"><div class=\"ace-line ace-line old-record-id-doxcnwfMz9HAcsQ9BL87BatG9ah\">Very reliable method of repairing if the part used for chip replacement is genuine.<\/div><\/td><\/tr><\/tbody><\/table><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6a2b556 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6a2b556\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-807a97d\" data-id=\"807a97d\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a99320d elementor-widget elementor-widget-heading\" data-id=\"a99320d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>When Should You Choose BGA Reballing? <\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-47daee1 elementor-widget elementor-widget-text-editor\" data-id=\"47daee1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnZ5p0z9x3rFftCO2tjDRiGg\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn5kb0QN4eABCOPuAjDnlPee\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-GOZDdwtL4oGjARx7FgvcuZwanQd\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnUYXTW9o8o64dZ2Rrdl82Uf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnC37L4Hq3VFAAAyCbgbvoCe\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnZf5sb08vHkSFgYQcaCoWHd\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnksoSM0QgwpoOcUsrt2Ja7g\">BGA reballing is used as a solution when the chips are still operational, but the solder joints have suffered damage. This allows for the connection to be reestablished at a lower price than replacing the entire chip. Here are a few scenarios given to understand the use of BGA reballing.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-66db167 elementor-widget elementor-widget-text-editor\" data-id=\"66db167\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnzLFjaCHY2YSYQnB9aKIsBd\"><strong>Intermittent Device Failure<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcn4aEUUwofNFePvXiLR9ud8e\">A cracked BGA solder joint causes a laptop, industrial controller, or video card to shut down or restart randomly. However, as long as the chip is functioning, reballing helps cure the problem by restoring the solder joints without replacing the entire<a href=\"https:\/\/www.elepcb.com\/blog\/integrated-circuit\/\"> IC.<\/a><\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6d25665 elementor-widget elementor-widget-text-editor\" data-id=\"6d25665\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcniEuq7qmot9adWpXqkNRfTe\"><strong>Thermal Cycling Has Damaged the Solder Joints<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnsCUqV5K3WxcCKaXYWpiiiO\">The cracks formed by thermal cycling frequently affect the solder balls of the devices. In that case, the use of reballing allows the solder joints to be substituted with new solder balls, maintaining the device.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-9aa74b5 elementor-widget elementor-widget-text-editor\" data-id=\"9aa74b5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><h3 class=\"heading-3 ace-line old-record-id-doxcnsNWUopO7LdOBBvhxB140lb\"><strong>High-Value and Difficult-to-Source Components<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-doxcntqZxpCYe9Yl8mYkT3K5krc\">Certain processors, GPUs, and ICs used in various <a href=\"https:\/\/www.elepcb.com\/applications\/pcb-for-industrial-equipments\/\">industrial applications<\/a> are either overpriced, obsolete, or hard to find. However, the BGA reballing provides a cost-efficient solution in cases where diagnostic tests have indicated that the only failure relates to the solder joints.<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4392a03 elementor-widget elementor-widget-text-editor\" data-id=\"4392a03\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-doxcnN3vTNMRcQ0efL2EQSwdtMh\"><strong>X-Ray<\/strong><strong> Inspection Confirms Solder Joint Failure<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-doxcnSlleWgQekfx6MXPtLWdKEf\">The use of X-ray inspection in solder joint failure is evidenced by the appearance of voids, cracked solder balls, or defective solder joints, while the chip itself is free of any <a href=\"https:\/\/www.elepcb.com\/blog\/solder-ball-on-pcbs\/\">defect<\/a>.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fd1f81c elementor-widget elementor-widget-image\" data-id=\"fd1f81c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"800\" height=\"600\" src=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/bga-board-x-ray-inspection-1024x768.png\" class=\"attachment-large size-large wp-image-22103\" alt=\"bga board x-ray inspection\" srcset=\"https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/bga-board-x-ray-inspection-1024x768.png 1024w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/bga-board-x-ray-inspection-300x225.png 300w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/bga-board-x-ray-inspection-768x576.png 768w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/bga-board-x-ray-inspection-16x12.png 16w, https:\/\/www.elepcb.com\/wp-content\/uploads\/2026\/07\/bga-board-x-ray-inspection.png 1280w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-ace2da1 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"ace2da1\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-95120ad\" data-id=\"95120ad\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-338c75a elementor-widget elementor-widget-heading\" data-id=\"338c75a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Common Causes of BGA Failure  <\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-d91a6a8 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"d91a6a8\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-inner-column elementor-element elementor-element-06cf859\" data-id=\"06cf859\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5b813bb elementor-widget elementor-widget-text-editor\" data-id=\"5b813bb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\"><div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\"><div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcnFhe24V3Pd2IfI61ATqRcKc\"><div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-KncBdFZGzoIfi8xCcpAcDHwOnqb\"><div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcnIoEd0ydgAO2oab1gVSD1Yd\"><div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcnbc28R8cL54H4oXgwhI1Uee\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcnb1Zg47Mc9l8IxitdVS0a3p\">Mechanical stress, differences in temperature, flaws in manufacturing, or inadequate handling lead to the majority of BGA failures.<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-54dfb77 elementor-widget elementor-widget-text-editor\" data-id=\"54dfb77\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcn65vyp4JAfKpFizhH4l7VIc\"><div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-G1UGd2YQBorHyOxo90bcPTXGnrd\"><div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-TOtrdayFpokgKtxJvnCcJAccn3b\"><div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><h3 class=\"heading-3 ace-line old-record-id-doxcnHwAlK090UwmjaNCaI3vQHc\"><strong>Thermal Cycling<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-doxcnw5YjoxNBjclefzzX0TAe7Q\">During normal operation of the device, solder joints go through multiple heating and cooling cycles, which cause them to expand and contract all the time. This leads to the formation of small cracks after some time, which disrupt electrical connections and can result in failure or malfunction of the device.<\/div><h3 class=\"heading-3 ace-line old-record-id-doxcn6XR4Pt8TiiBxSnIJtCs4Lf\"><strong>Mechanical Stress <\/strong><\/h3><div class=\"ace-line ace-line old-record-id-doxcn3OiBxZYpk7a8XzgZeMfqRf\">Mechanical stress imposed on solder joints due to bending boards, <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-teardrop\/\">drops<\/a>, vibrations, and manual actions leads solder balls to weaken and crack at some point, causing poor electrical operation.<\/div><h3 class=\"heading-3 ace-line old-record-id-doxcn4CZWcehXT9F6mJ5VkUwhvc\"><strong>Poor Manufacturing Quality<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-doxcnKwQp17aKzqJeob9f4OObAc\">Incorrect solder quantity, wrong heating processes, poor stencil alignment, or other contaminants can lead to weak solder joints between the chip and the PCB. While it might not seem like a big issue early on, weak solder joints can later cause failures during operation.<\/div><h3 class=\"heading-3 ace-line old-record-id-doxcnD65yqmnKTxUYewODpeZz4f\"><strong>Overheating <\/strong><\/h3><div class=\"ace-line ace-line old-record-id-doxcn0dGD7nWgQRYbwF3HMPduNf\">Insufficient cooling system, blocking of aeration and the heat always being above a constant temperature lead to fatigue of solder joints and oxidation of solder material. Prolonged overheating weakens solder, making it last not too long and increasing the odds of errors occurring with BGA soldering.<\/div><h3 class=\"heading-3 ace-line old-record-id-doxcnD2E3H9cBT24zFgthc7xFIe\"><strong>Pollution and Oxidation<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-doxcnthN1dgE1omzVKTdZ0EGbTg\">Humidity, dirt, flux residues and <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-corrosion-issues\/\">oxidation<\/a> affect the quality of solder, decreasing bonding strength between the chip and PCB. Polluted solder joints are of low reliability and susceptible to damage during prolonged operation and temperature variations.<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-ebe6adf elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"ebe6adf\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-037f439\" data-id=\"037f439\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-1b713ed elementor-widget elementor-widget-heading\" data-id=\"1b713ed\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>How to Prevent BGA Failures During PCB Assembly<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1540a4d elementor-widget elementor-widget-text-editor\" data-id=\"1540a4d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"AwAwdRVeHoZhepxJpSIcAl95nUe\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn1OSAKQa6SeGBNOsmQbaogh\">\n<div data-page-id=\"WnNodxTJeoiBq2xibjZcALH4nnh\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-CfTXd89ICoHauHxfMOmcUhEEn7b\">\n<div data-page-id=\"CDXid7bJ0oEcpBxXIcHcUHZUnae\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnaI4vnZLL9JLVv4l4ZdnGsd\">\n<div data-page-id=\"IpJ0dDvvaoe4uBxaRPoceznanof\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnyCBLLQ0TYBlJRfei6sd3Hf\">\n<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcnIYKxtYEwfuD30pqyoiXHug\">\n<div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-doxcn5zG4KWf4qidXYPWiZdJ4Jj\">\n<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<div class=\"ace-line ace-line old-record-id-YzOidHbekoP9ZCxUPluch1J7neg\">BGA reballing only fixes certain <a href=\"https:\/\/www.elepcb.com\/blog\/cold-solder-joint\/\">solder joint defects<\/a>, but typically this method is a reactive one after defects have happened. It&#8217;s a better solution for manufacturers to prevent BGA failures at the PCB assembly stage because it saves money and improves product reliability.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7d44ce4 elementor-widget elementor-widget-text-editor\" data-id=\"7d44ce4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">\n<h3 class=\"heading-3 ace-line old-record-id-I1DbdKiLkov6qAx1MIZcrciSn7g\"><strong>Optimize PCB Design Before Assembly<\/strong><\/h3>\n<div class=\"ace-line ace-line old-record-id-OpAwdpnZCoYhwyxPdE1cOlEJnKe\">In fact, it is possible to prevent many problems from the design stages. If the PCB layout is properly done, it will result in reliable solder connections and will also be a source of minimum stress on BGA components.<\/div>\n<div class=\"ace-line ace-line old-record-id-F6CkdsABpoZaAgxJn5YcU43TnHd\">Key design considerations include:<\/div>\n<ul class=\"list-bullet1\">\n<li class=\"ace-line ace-line old-record-id-IBB1ddlqioG96JxAwaecDsAKngc\" data-list=\"bullet\">\n<div><strong>Correct <\/strong><strong>BGA<\/strong><strong> footprint design:<\/strong> The PCB pad size, pitch, and solder mask opening should fit perfectly with the BGA&#8217;s dimensions for a good solder joint.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-GCG5dqPNvoUzsxxbZBVcyVJbnUb\" data-list=\"bullet\">\n<div><strong>Adequate <\/strong><strong>PCB<\/strong><strong> layer stack-up:<\/strong> Suitable <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-layers\/\">PCB layer stacking<\/a> is achieved through the right layer arrangement so that signal integrity is maintained, which also prevents excessive bending in the board during assembly.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-AfDBdVmRYoL5LZxVbPEcQNNunoe\" data-list=\"bullet\">\n<div><strong>Copper balance:<\/strong> Uneven copper distribution can distort the board during reflow soldering; BGA alignment and solder joint reliability would suffer as a result.<\/div>\n<\/li>\n<li class=\"ace-line ace-line old-record-id-AELxdPTzwouNSCxFlQrcAgYbnob\" data-list=\"bullet\">\n<div><strong>Thermal management design:<\/strong> <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-copper-thickness\/\">Copper<\/a> areas and thermal vias can be used to effectively carry away heat and limit thermal stress on solder joints.<\/div>\n<\/li>\n<\/ul>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c2452a6 elementor-widget elementor-widget-text-editor\" data-id=\"c2452a6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><h3 class=\"heading-3 ace-line old-record-id-WJDtd6hl1oeY4WxoiIccJQgVnYc\"><strong>Control Solder Paste Printing Quality<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-WaBhd2r2hoCXFMx4PXwct94Inig\">The reliability of BGA solder joints is directly affected by the solder paste printing process. Incorrect solder volume or uneven paste deposition can result in open connections, insufficient solder joints, or solder bridging.<\/div><div class=\"ace-line ace-line old-record-id-AMGhdE7OZoDMX7xLvsgct4oLnms\">To reduce these risks, manufacturers should control:<\/div><ul class=\"list-bullet1\"><li class=\"ace-line ace-line old-record-id-XXEQdy17doEQ9zxV0z5cMQfgnPe\" data-list=\"bullet\"><div><strong>Stencil design and thickness<\/strong> to achieve consistent solder paste volume.<\/div><\/li><li class=\"ace-line ace-line old-record-id-NH2WdJkEzoOnlWxzi5rcsBH6ntc\" data-list=\"bullet\"><div><strong>Solder paste storage and handling<\/strong> to maintain proper material performance.<\/div><\/li><li class=\"ace-line ace-line old-record-id-Ag9ZdJFRfogYpPxAZ7ccg0JanBc\" data-list=\"bullet\"><div><strong>Printing parameters<\/strong>, including pressure, speed, and alignment accuracy.<\/div><\/li><li class=\"ace-line ace-line old-record-id-ZLRTdG38toq4qFxWiqdcoKXgnAh\" data-list=\"bullet\"><div><strong><a href=\"https:\/\/www.elepcb.com\/blog\/pcb-solder-paste\/\">Solder paste<\/a> inspection (<\/strong><strong>SPI<\/strong><strong>)<\/strong> to detect printing defects before component placement.<\/div><\/li><\/ul><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c72a506 elementor-widget elementor-widget-text-editor\" data-id=\"c72a506\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><h3 class=\"heading-3 ace-line old-record-id-RWtlds2h0oZTJSx3BsdcYjranzF\"><strong>Maintain Accurate Component Placement and Reflow Profiles<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-SFuad3pu0osoqvxXCX4cRRj8nPh\">Precise placement and controlled <a href=\"https:\/\/www.elepcb.com\/blog\/pcb-reflow-soldering\/\">reflow soldering<\/a> are essential for BGA reliability.<\/div><div class=\"ace-line ace-line old-record-id-NvTsd9EpAojSErxmpiDcdyPcn0e\"><strong>During component placement:<\/strong><\/div><ul class=\"list-bullet1\"><li class=\"ace-line ace-line old-record-id-JuUmd8EJzoamZJxUM35cfTidnUg\" data-list=\"bullet\"><div>High-precision placement equipment ensures accurate alignment between BGA solder balls and PCB pads.<\/div><\/li><li class=\"ace-line ace-line old-record-id-TmkUd0rlpoFHKwx73dYc87etnGf\" data-list=\"bullet\"><div>Proper component positioning prevents solder joint defects caused by misalignment.<\/div><\/li><\/ul><div class=\"ace-line ace-line old-record-id-GmhzdzMW4oSSphxUXyQcd1FIn8d\"><strong>During reflow soldering:<\/strong><\/div><ul class=\"list-bullet1\"><li class=\"ace-line ace-line old-record-id-SFxudaVbBommjfxoPVfcCacGn9d\" data-list=\"bullet\"><div>The temperature profile of the reflow oven will need to be appropriately determined based on the composition of the solder paste and the size of the BGA package.<\/div><\/li><li class=\"ace-line ace-line old-record-id-QCUfdo3CgontC2xSfI7cKO84nxb\" data-list=\"bullet\"><div>Solders or other parts might be melted or damaged by a very high temperature, and solder joints can become fatigued.<\/div><\/li><li class=\"ace-line ace-line old-record-id-RWeJdL8DyoVc2qxTNgQcx1mAnPe\" data-list=\"bullet\"><div>However, soldering at too low a temperature might lead to underheated melts that result in weak or failed joints.<\/div><\/li><\/ul><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4b718a3 elementor-widget elementor-widget-text-editor\" data-id=\"4b718a3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><h3 class=\"heading-3 ace-line old-record-id-PI3ad3kOLol4bfxIILncpc8fnGc\"><strong>Use X-Ray Inspection for Hidden BGA Defects<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-U4zwdyyaTofAoqxqKUwcsWE7nNe\"><a href=\"https:\/\/www.elepcb.com\/blog\/pcb-x-ray-inspection\/\">X-ray inspection<\/a> is essential for identifying hidden defects, including:<\/div><ul class=\"list-bullet1\"><li class=\"ace-line ace-line old-record-id-N37Td36QRoMeeax0WLLc3P6JnDc\" data-list=\"bullet\"><div>Solder voids<\/div><\/li><li class=\"ace-line ace-line old-record-id-Rx78dlCE2o1kEfxdcSFcbMN8n7E\" data-list=\"bullet\"><div>Insufficient solder joints<\/div><\/li><li class=\"ace-line ace-line old-record-id-DQzWdUFNNodapOxPAtFcXzBGnzb\" data-list=\"bullet\"><div>Solder bridging<\/div><\/li><li class=\"ace-line ace-line old-record-id-BopedjTc6olrhSx2J91cr6aWn7d\" data-list=\"bullet\"><div>Misalignment between BGA balls and PCB pads<\/div><\/li><li class=\"ace-line ace-line old-record-id-Kv2DdWUdCo4wfqxq73lc4nsmnGg\" data-list=\"bullet\"><div>Cracked or irregular solder connections<\/div><\/li><\/ul><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5d3d142 elementor-widget elementor-widget-text-editor\" data-id=\"5d3d142\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><h3 class=\"heading-3 ace-line old-record-id-NaJqdobwxooujaxBunRcO48VnLh\"><strong>Perform Functional Testing and Reliability Validation<\/strong><\/h3><div class=\"ace-line ace-line old-record-id-WjnndQWH7ozVxPxROjacPIdPnHd\">Even when solder joints appear acceptable, there may still be electrical or mechanical issues that affect long-term reliability. Comprehensive testing helps ensure that assembled printed circuit boards (PCBs) meet performance requirements.<\/div><div class=\"ace-line ace-line old-record-id-QzgIdtFpfoLIvBxLhhsciyvBnRf\">Common validation methods include:<\/div><ul class=\"list-bullet1\"><li class=\"ace-line ace-line old-record-id-Aq21d2wfmoGWCPxBSsjc9P1Bn4g\" data-list=\"bullet\"><div><a href=\"https:\/\/www.elepcb.com\/blog\/pcb-aoi-inspection\/\"><strong>Automated Optical Inspection<\/strong><strong> (<\/strong><strong>AOI<\/strong><strong>)<\/strong><\/a> for visible soldering and placement defects.<\/div><\/li><li class=\"ace-line ace-line old-record-id-ToOTdEgrYo5pL6xgTMOci8n2njy\" data-list=\"bullet\"><div><a href=\"https:\/\/www.elepcb.com\/blog\/ict-test-in-pcb\/\"><strong>In-Circuit Testing (ICT)<\/strong> <\/a>to verify electrical connections.<\/div><\/li><li class=\"ace-line ace-line old-record-id-HGXmdWteuo4TJaxP3EYcfqHunAg\" data-list=\"bullet\"><div><a href=\"https:\/\/www.elepcb.com\/blog\/pcba-test\/\"><strong>Functional Testing (FCT)<\/strong> <\/a>to evaluate actual product performance.<\/div><\/li><li class=\"ace-line ace-line old-record-id-Yi6PdjDMWon0FfxQIm0cRR7wnnb\" data-list=\"bullet\"><div><strong>Thermal cycling testing<\/strong> for applications exposed to temperature changes.<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-940edb8 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"940edb8\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-50886fb\" data-id=\"50886fb\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-03a2e0e elementor-widget elementor-widget-heading\" data-id=\"03a2e0e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Reduce BGA Rework with Professional PCB Assembly Services<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e415500 elementor-widget elementor-widget-text-editor\" data-id=\"e415500\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div data-page-id=\"TePmd5uV1oQoxfxyBNfc0siLnuf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcnH052Xla1jTt65zV5oyJYoe\"><div data-page-id=\"WSJudY8GqoWRaGxl0Bqc0Y40n3g\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-DUZDdwHU0oAyUfxm3rTcs5T3nYg\"><div data-page-id=\"EMFSdfngQod6VqxbGB9cHhvkn39\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-doxcnKQP8Go0kvEZ6N6QM3BQhNc\">The BGA reballing repair method enables restoration of deteriorated soldering connections while maintaining the original IC component. If it is performed following the right procedure, with the right components and appropriate checking, it can provide dependable electrical performance and prolong the operation of electronic devices.<\/div><div class=\"ace-line ace-line old-record-id-XWMCdoNoRo93J8xjOofct8Z3nkj\">Although BGA reballing is an effective solution for repairing certain solder joint failures, the best strategy for improving reliability and reducing production costs is to<strong> prevent defects during PCB assembly.<\/strong><\/div><div class=\"ace-line ace-line old-record-id-Qh3sdMO92oZJkMxU2g5cWWMln0g\">ELEPCB provides<a href=\"https:\/\/www.elepcb.com\/blog\/turnkey-pcb-assembly\/\"> turnkey PCB assembly services<\/a> with advanced SMT manufacturing capabilities, professional inspection processes, and engineering support. From prototype to mass production, we&#8217;re here to help customers achieve reliable BGA assembly.<\/div><div class=\"ace-line ace-line old-record-id-D4WqdIzYToipoTxXqFNc3ycSnTb\"><em><a href=\"https:\/\/www.elepcb.com\/contact-us\/\"><strong>Contact us today<\/strong><\/a> <\/em>to discuss your detailed requirements!<\/div><\/div><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-48e45a77 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"48e45a77\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-2c76c47e\" data-id=\"2c76c47e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-02fcb3d elementor-widget elementor-widget-heading\" data-id=\"02fcb3d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>FAQs<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4c8d84da elementor-widget elementor-widget-toggle\" data-id=\"4c8d84da\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"toggle.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-toggle\">\n\t\t\t\t\t\t\t<div class=\"elementor-toggle-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1281\" class=\"elementor-tab-title\" data-tab=\"1\" role=\"button\" aria-controls=\"elementor-tab-content-1281\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon elementor-toggle-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-closed\"><i class=\"fas fa-caret-right\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-opened\"><i class=\"elementor-toggle-icon-opened fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-toggle-title\" tabindex=\"0\">Q1: What is the difference between BGA reballing and BGA rework?<\/a>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div id=\"elementor-tab-content-1281\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"1\" role=\"region\" aria-labelledby=\"elementor-tab-title-1281\"><div data-page-id=\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div data-page-id=\"PzvadCyLxoGC6axfsi0cBB2BnWf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\">A1: BGA reballing is the process of removing previously used solder balls from a BGA component and installing new ones before the component is put back into place again. However, BGA rework is a wider process that includes removal, repair, replacement, or installation of a BGA part, and reballing is only one of the methods used during this process.<\/div><\/div><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-toggle-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1282\" class=\"elementor-tab-title\" data-tab=\"2\" role=\"button\" aria-controls=\"elementor-tab-content-1282\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon elementor-toggle-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-closed\"><i class=\"fas fa-caret-right\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-opened\"><i class=\"elementor-toggle-icon-opened fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-toggle-title\" tabindex=\"0\">Q2: Can BGA reballing fix a display problem in the laptop permanently?<\/a>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div id=\"elementor-tab-content-1282\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"2\" role=\"region\" aria-labelledby=\"elementor-tab-title-1282\"><div data-page-id=\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-BWQ0dJKPTovPhYx6XTfc9xMAngc\"><div data-page-id=\"PzvadCyLxoGC6axfsi0cBB2BnWf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-ZGjidQpZuouEMuxnruBcR4Ujndg\">A2: If the reason for the display problem in the laptop lies in cracked BGA solder joints and the chip is indeed working, then such problems may be resolved permanently. If the graphics processor or chipset has sustained some damage inside, the problems will not be settled by reballing only, as swapping the chip becomes inevitable.<\/div><\/div><\/div><\/div><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-toggle-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1283\" class=\"elementor-tab-title\" data-tab=\"3\" role=\"button\" aria-controls=\"elementor-tab-content-1283\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon elementor-toggle-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-closed\"><i class=\"fas fa-caret-right\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-opened\"><i class=\"elementor-toggle-icon-opened fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-toggle-title\" tabindex=\"0\">Q3: Can any graphics card that has failed be repaired through the process of BGA reballing?<\/a>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div id=\"elementor-tab-content-1283\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"3\" role=\"region\" aria-labelledby=\"elementor-tab-title-1283\"><div data-page-id=\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\" old-record-id-VIvSds1JnokGWWxGglucirLXn4O\"><div data-page-id=\"PzvadCyLxoGC6axfsi0cBB2BnWf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-XizidTe9soWkg0xX1N9cjCycnJd\">A3: Yes. However, BGA reballing will only allow correcting the situation if the failure came from damaged solder joints under the GPU or memory chips. In the case of the solder balls being cracked due to heat cycling, mechanical shocks, or high temperatures, BGA reballing is sufficient, but it is not able to fix the problem.<\/div><\/div><\/div><\/div><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"elementor-toggle-item\">\n\t\t\t\t\t<div id=\"elementor-tab-title-1284\" class=\"elementor-tab-title\" data-tab=\"4\" role=\"button\" aria-controls=\"elementor-tab-content-1284\" aria-expanded=\"false\">\n\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon elementor-toggle-icon-left\" aria-hidden=\"true\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-closed\"><i class=\"fas fa-caret-right\"><\/i><\/span>\n\t\t\t\t\t\t\t\t<span class=\"elementor-toggle-icon-opened\"><i class=\"elementor-toggle-icon-opened fas fa-caret-up\"><\/i><\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-toggle-title\" tabindex=\"0\">Q4: When should you choose chip replacement over BGA reballing?<\/a>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div id=\"elementor-tab-content-1284\" class=\"elementor-tab-content elementor-clearfix\" data-tab=\"4\" role=\"region\" aria-labelledby=\"elementor-tab-title-1284\"><div data-page-id=\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\" old-record-id-VIvSds1JnokGWWxGglucirLXn4O\"><div data-page-id=\"PzvadCyLxoGC6axfsi0cBB2BnWf\" data-lark-html-role=\"root\" data-docx-has-block-data=\"false\"><div class=\"ace-line ace-line old-record-id-XizidTe9soWkg0xX1N9cjCycnJd\">A4: Chip replacement is a better alternative when it is established that the chip has undergone damage due to overheating, electrical malfunction, or physical defects. In this case, it is worth mentioning that reballing only restores the soldering connections. Therefore, chip replacement should be implemented in instances when the internal circuitry is damaged.<\/div><\/div><\/div><\/div><\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t<script type=\"application\/ld+json\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@type\":\"FAQPage\",\"mainEntity\":[{\"@type\":\"Question\",\"name\":\"Q1: What is the difference between BGA reballing and BGA rework?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<div data-page-id=\\\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div data-page-id=\\\"PzvadCyLxoGC6axfsi0cBB2BnWf\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\">A1: BGA reballing is the process of removing previously used solder balls from a BGA component and installing new ones before the component is put back into place again. However, BGA rework is a wider process that includes removal, repair, replacement, or installation of a BGA part, and reballing is only one of the methods used during this process.<\\\/div><\\\/div>\"}},{\"@type\":\"Question\",\"name\":\"Q2: Can BGA reballing fix a display problem in the laptop permanently?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<div data-page-id=\\\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div class=\\\"ace-line ace-line old-record-id-BWQ0dJKPTovPhYx6XTfc9xMAngc\\\"><div data-page-id=\\\"PzvadCyLxoGC6axfsi0cBB2BnWf\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div class=\\\"ace-line ace-line old-record-id-ZGjidQpZuouEMuxnruBcR4Ujndg\\\">A2: If the reason for the display problem in the laptop lies in cracked BGA solder joints and the chip is indeed working, then such problems may be resolved permanently. If the graphics processor or chipset has sustained some damage inside, the problems will not be settled by reballing only, as swapping the chip becomes inevitable.<\\\/div><\\\/div><\\\/div><\\\/div>\"}},{\"@type\":\"Question\",\"name\":\"Q3: Can any graphics card that has failed be repaired through the process of BGA reballing?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<div data-page-id=\\\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div class=\\\" old-record-id-VIvSds1JnokGWWxGglucirLXn4O\\\"><div data-page-id=\\\"PzvadCyLxoGC6axfsi0cBB2BnWf\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div class=\\\"ace-line ace-line old-record-id-XizidTe9soWkg0xX1N9cjCycnJd\\\">A3: Yes. However, BGA reballing will only allow correcting the situation if the failure came from damaged solder joints under the GPU or memory chips. In the case of the solder balls being cracked due to heat cycling, mechanical shocks, or high temperatures, BGA reballing is sufficient, but it is not able to fix the problem.<\\\/div><\\\/div><\\\/div><\\\/div>\"}},{\"@type\":\"Question\",\"name\":\"Q4: When should you choose chip replacement over BGA reballing?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<div data-page-id=\\\"K5cQdPyqAoIVz9xiCVzcrjK4n2e\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div class=\\\" old-record-id-VIvSds1JnokGWWxGglucirLXn4O\\\"><div data-page-id=\\\"PzvadCyLxoGC6axfsi0cBB2BnWf\\\" data-lark-html-role=\\\"root\\\" data-docx-has-block-data=\\\"false\\\"><div class=\\\"ace-line ace-line old-record-id-XizidTe9soWkg0xX1N9cjCycnJd\\\">A4: Chip replacement is a better alternative when it is established that the chip has undergone damage due to overheating, electrical malfunction, or physical defects. In this case, it is worth mentioning that reballing only restores the soldering connections. Therefore, chip replacement should be implemented in instances when the internal circuitry is damaged.<\\\/div><\\\/div><\\\/div><\\\/div>\"}}]}<\/script>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-51779fbb elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"51779fbb\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7acf56f\" data-id=\"7acf56f\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-4e1fc9ff elementor-widget 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elementor-field-group-field_c168eb1 elementor-col-100\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_c168eb1\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tI am interested in (select all that apply)\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t<div class=\"elementor-field-subgroup  elementor-subgroup-inline\"><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Rigid PCBs\" id=\"form-field-field_c168eb1-0\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-0\">Rigid PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Flexible Printed Circuit Boards\" id=\"form-field-field_c168eb1-1\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-1\">Flexible Printed Circuit Boards<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Flexible Aluminum PCBs\" id=\"form-field-field_c168eb1-2\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-2\">Flexible Aluminum PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Flexible PCB Microcircuits\" id=\"form-field-field_c168eb1-3\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-3\">Flexible PCB Microcircuits<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Ultra-Thin Flexible PCBs\" id=\"form-field-field_c168eb1-4\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-4\">Ultra-Thin Flexible PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Rigid-Flex\" id=\"form-field-field_c168eb1-5\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-5\">Rigid-Flex<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Ceramic Printed Circuit Boards\" id=\"form-field-field_c168eb1-6\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-6\">Ceramic Printed Circuit Boards<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Aluminum Printed Circuit Boards\" id=\"form-field-field_c168eb1-7\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-7\">Aluminum Printed Circuit Boards<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Copper Core\" id=\"form-field-field_c168eb1-8\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-8\">Copper Core<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"IC Substrates &amp; Interposer\" id=\"form-field-field_c168eb1-9\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-9\">IC Substrates & Interposer<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"High TG PCBs\" id=\"form-field-field_c168eb1-10\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-10\">High TG PCBs<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Heavy Copper\" id=\"form-field-field_c168eb1-11\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-11\">Heavy Copper<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"PCB Assembly\" id=\"form-field-field_c168eb1-12\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-12\">PCB Assembly<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Components Sourcing\" id=\"form-field-field_c168eb1-13\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-13\">Components Sourcing<\/label><\/span><span class=\"elementor-field-option\"><input type=\"checkbox\" value=\"Other\" id=\"form-field-field_c168eb1-14\" name=\"form_fields[field_c168eb1][]\"> <label for=\"form-field-field_c168eb1-14\">Other<\/label><\/span><\/div>\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-upload elementor-field-group elementor-column elementor-field-group-field_2cea676 elementor-col-100\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_2cea676\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tUpload Your Files (Optional)\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t\t\t<input type=\"file\" name=\"form_fields[field_2cea676]\" id=\"form-field-field_2cea676\" class=\"elementor-field elementor-size-sm  elementor-upload-field\">\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-type-textarea elementor-field-group elementor-column elementor-field-group-field_9ceb2c8 elementor-col-100\">\n\t\t\t\t\t\t\t\t\t\t\t\t<label for=\"form-field-field_9ceb2c8\" class=\"elementor-field-label\">\n\t\t\t\t\t\t\t\tMessage\t\t\t\t\t\t\t<\/label>\n\t\t\t\t\t\t<textarea class=\"elementor-field-textual elementor-field  elementor-size-sm\" name=\"form_fields[field_9ceb2c8]\" id=\"form-field-field_9ceb2c8\" rows=\"4\"><\/textarea>\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-group elementor-column elementor-field-type-submit elementor-col-100 e-form__buttons\">\n\t\t\t\t\t<button class=\"elementor-button elementor-size-sm\" type=\"submit\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Submit<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/button>\n\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/form>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-inner-column elementor-element elementor-element-123957a9\" data-id=\"123957a9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap\">\n\t\t\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Table of Contents BGA packages are widely used in modern electronic devices as they offer high-density interfacing plus better electrical performance. However, BGA components&#8217; hidden solder joints also make them more difficult to inspect and repair when assembly defects or long-term reliability issues arise. BGA reballing is used to fix a broken BGA chip rather [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":22101,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[44],"tags":[],"class_list":["post-22100","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog"],"_links":{"self":[{"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/posts\/22100","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/users\/26"}],"replies":[{"embeddable":true,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/comments?post=22100"}],"version-history":[{"count":13,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/posts\/22100\/revisions"}],"predecessor-version":[{"id":22116,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/posts\/22100\/revisions\/22116"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/media\/22101"}],"wp:attachment":[{"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/media?parent=22100"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/categories?post=22100"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.elepcb.com\/it\/wp-json\/wp\/v2\/tags?post=22100"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}