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Ceramic PCB

Nowadays, Ceramic PCBs have emerged as a ground-breaking solution among the most recent advancements in PCB technology, providing improved performance and dependability.

In this article, we will dive into the complexities of ceramic PCBs, investigating their advantages, applications, producing cycles, and considerably more. 

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Table of Contents

What are Ceramic PCBs?

Ceramic PCBs address a state-of-the-art development in the domain of electronic parts. Dissimilar to conventional PCBs that utilization fiberglass or other substrate materials, Earthenware PCBs use a ceramic base for worked on warm conductivity and electrical protection.

Key Features of Ceramic PCBs

  • High Warm Conductivity: One of the champion highlights of Ceramic PCBs is their uncommon warm conductivity. This property permits them to scatter heat more proficiently than traditional PCBs, making them ideal for applications with high-power parts.
  • Amazing Electrical Protection: Ceramics, like alumina and aluminum nitride, show brilliant electrical protection properties. This ensures that the PCB’s conductive traces remain well isolated, reducing the likelihood of electrical leakage and increasing the circuit’s overall reliability.
  • Mechanical Strength: Earthenware PCBs gloat noteworthy mechanical strength and sturdiness, giving heartiness in cruel working conditions. This makes them appropriate for applications where mechanical pressure and vibrations are pervasive.
  • Synthetic Opposition: The ceramic material utilized in these PCBs is impervious to different synthetic compounds, further improving their appropriateness for applications in destructive conditions.
Ceramic PCB
Ceramic PCB

Benefits of Ceramic PCBs Compared to Conventional PCBs​

  • Ordinary PCBs are typically made of copper foil and substrate bonding, with the majority of the substrate material being glass fiber (FR-4), phenolic resin (FR-3), and phenolic, epoxy, or other adhesives. Thermal stress, chemical causes, incorrect production processes, or the design of asymmetric copper lying on both sides of the PCB board can all cause varying degrees of warpage during PCB processing
  • Unlike conventional PCBs, which employ adhesives to attach the copper foil to the substrate, ceramic PCBs are assembled by gluing the copper foil to the ceramic substrate at high temperatures. This ensures that the copper foil does not flake off, and that the PCBs perform reliably in extreme temperature and humidity settings
  • Ceramic PCBs are suitable for high-power applications also due to their efficient heat dissipation and high thermal conductivity.
  • Ceramic PCBs offer improved dependability and toughness, making them ideal for basic applications where disappointment isn’t a choice.
  • The high mechanical robustness of ceramics allows for the production of slenderer and more modest PCBs, contributing to the trend of scaling down in electrical devices.
  • The obstruction of earthenware production to synthetic substances improves the life span of PCBs in destructive conditions. 

Different Types of Ceramic PCB

Ceramic Printed Circuit Boards (PCBs) are known for their excellent thermal conductivity, electrical insulation, and stability in extreme environments. They come in various types, each suited for specific applications:

Aluminum Oxide PCB (Al2O3)

Alumina PCBs are the most common type of ceramic PCBs. They are made from aluminum oxide and are known for their good thermal conductivity, electrical insulation, and mechanical strength. They are widely used in LED lighting, high-power circuits, and automotive electronics.

Beryllium Oxide (BeO) PCB

Beryllium oxide PCBs are known for their extremely high thermal conductivity, but they are less common due to the toxicity of beryllium oxide. They are used in applications that require rapid heat dissipation, such as in military and aerospace electronics.

Aluminum Nitride (AlN) PCB

The common elements aluminum and nitrogen are combined to create aluminum nitride (AlN), a covalently linked ceramic. It doesn’t happen naturally. 

These PCBs are made from aluminum nitride and offer superior thermal conductivity compared to alumina PCBs. They are ideal for high-power applications and situations where efficient heat dissipation is crucial, such as in power electronics and high-frequency applications. AlN can be utilized in biomedical applications, wear components and tools, and metrology.

Silicon Carbide (SiC) PCB

Silicon carbide is a semiconductor material that is used in PCBs for high-frequency, high-power, and high-temperature applications. It’s particularly suitable for power devices and RF applications.

Applications of Ceramic PCBs in High-Frequency Electronics

Ceramic PCBs are widely utilized in semiconductor packaging, sensors, radar, new energy, automotive, and communication industries.

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Aerospace and Defense

The aviation and protection enterprises request parts that can endure outrageous circumstances. Ceramic PCBs, with their high warm conductivity and solidness, track down broad use in flying, radar frameworks, and rocket direction frameworks.

Automotive Electronics

In the auto area, where unwavering quality is central, Fired PCBs are utilized in electronic control units (ECUs), power modules, and Drove lighting frameworks. Their capacity to deal with high temperatures and vibrations pursues them a favored decision in the car gadgets scene.

High-Power Led Lighting

As the interest in energy-productive lighting arrangements rises, so does the utilization of Ceramic PCBs in Drove applications. The high warm conductivity of ceramics guarantees productive intensity dissemination, adding to the life span and dependability of Driven modules.

High-Frequency Electronics

Ceramic PCBs have no outgassing, are totally water resistant, have minimal signal loss, and can withstand chemicals in addition to UV rays. RF (radio frequency) devices, microwave circuits, and radar systems.

While Ceramic PCBs offer various benefits, considering specific difficulties and factors is fundamental:

  • Cost: The assembling of Artistic PCBs includes specific cycles, making them somewhat more costly than customary PCBs.
  • Fragility: Ceramics can be fragile, and intense consideration is required during taking care of to forestall breakage.
  • Intricacy of Assembling: The assembling system of Fired PCBs is more intricate contrasted with conventional PCBs, requiring aptitude and particular hardware.

As innovation keeps on propelling, a few patterns and developments are molding the fate of Ceramic PCBs:

  • High-level Earthenware production: Advanced ceramics with even greater mechanical strength and thermal conductivity are being investigated in ongoing materials science research.
  • Reconciliation of Nanotechnology: Ceramic PCB manufacturing processes incorporate nanotechnology to enhance performance and produce electronic devices that are more effective.
  • Application in 5G Innovation: With the rollout of 5G innovation, the interest in high-recurrence and elite execution PCBs, including Earthenware PCBs, is supposed to rise.
  • Expanded Robotization: It is likely that more automation will be used to make Ceramic PCBs, which will make things more efficient and less expensive.

Fabricating Cycle and Manufacturing Process of Ceramic PCBs​

Fabricating Cycle

Ceramic PCB Process

Substrate preparation

The assembling system of Fired PCBs starts with the arrangement of the earthenware substrate. Alumina (Al₂O₃) and aluminum nitride (AlN) are normal decisions for substrate materials because of their beneficial properties.

Screen Printing

Using a process called screen printing, conductive traces and patterns are printed onto the ceramic substrate. This step is significant in characterizing the circuit format and electrical associations.

Via Hole Drilling

Through openings, which consider electrical associations between various layers of the PCB, are bored into the artistic substrate. This cycle expects accuracy to guarantee appropriate arrangement of the openings.


In the wake of boring, the by means of openings are metallized to make conductive pathways between the layers. A deposition procedure, in which a thin layer of metal is applied to the via hole surfaces, is typically used to accomplish this.


 In sintering, the ceramic substrate is heated to high temperatures, which causes the metal layers to join the ceramic. This step improves the general strength and conductivity of the PCB.

Component Attachment

Electronic parts are then appended to the Fired PCB utilizing patching or other appropriate techniques. The gathering system expects accuracy to guarantee the unwavering quality and execution of the eventual outcome.

The Manufacturing Process




Normal Process

Moderate Difficulty (control or planning focus)

Unconventional Required



(1) Al₂O₃ (96%)

(2) AlN (Heat Conduction 170-120W)

(1) Al₂O₃ (99%)

(2) AlN (Heat Conduction 200-230W)

ZrO2, BeO, Si3N4


Number of Layer

single-sided, double-sided

3D dam enclosure

multilayer ceramic


Sheet Thickness

(1) Al₂O₃(0.38, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5, 1.8, 1.0, 1.2, 1.5, 1.8, 2.0, 2.5MM)

(2) AlN (0.38, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5, 1.8, 1.0, 1.2, 1.5, 1.8, 2.0, 2.5, 3.0, 3.5MM)

(1) Al₂O₃ (0.125,0.2,0.25,0.3mm,3.0,3.5MM)

(2) AlN (0.25,0.3MM)

Sheet Thickness of Substrate≥3.5MM


Surface Coating

ENIG, Immersion Silver, Immersion Tin, ENEPIG

Gold Plating (size<5%)

Gold Plating (size>50%), Silver plating, Spray tin


Coating Thickness

Electric Nickel Gold (microinches) NI:120-200, AU:1-2.5

Full gold plating (microinches) NI:120-200, AU:5-20

Electric Nickel Palladium (microinches) NI:120-200, PD:0.5, AU:1-2.5

Electroless Nickel Gold (micro size) N:200-250, AU:2.5-5

Full gold plating (micro size) NI:200-250, AU:20-100 

Electroless Nickel Palladium (micro size) NI:200, PD:0.5-1.5, AU:2.5-4

beyond control


Laser Drilling

Sheet Thickness

Minimal Hole Size

Sheet Thickness

Minimal Hole Size

Sheet Thickness of Substrate≥3.0MM










































Solder Mask Bridge





Solder Color

Green oil, light green oil, matte green oil,  blue oil, matte blue oil, yellow oil, red oil, black oil, matte black oil

transparent, grey

fluorescence green oil


Shape Tolerance


0.15MM<Shape Tolerance≤0.1MM






beyond control


As innovation keeps on developing, the interest in Ceramic PCBs is supposed to develop, driven by the requirement for solid and elite execution electronic arrangements.

If you want to incorporate Ceramic PCBs into your electronic designs, you need to work with seasoned manufacturers who are familiar with the specifics of this cutting-edge technology. While high-quality components and compliance with safety requirements have an impact on total cost, the price of a Power Supply PCB might vary depending on design complexity, board size, and quantity ordered. Manufacturers such as ElEpcb understand the significance of these issues in providing dependable PCB solutions.

Elepcb is one of the leading Ceramic PCB manufacturers committed to quality, efficiency, and industry standards, guaranteeing that your electrical systems perform optimally. Contact us today to discuss your power supply PCB requirements.


ELE PCB has got the IS09001:2015, IS013485:2016, ROHS and FCC certifications. We can offer all kinds of services, including PCB manufacturing and PCB assembly, sample orders and batch orders. For PCB assembly, utilizing 7 high-speed SMT PCBA lines from Yamaha and Sony, to meet our customers’ needs. Our extended services include PCB design &PCB Layout, hardware design engineering, firmware &software development, and personalization. ELE company is honored as an excellent supplier from any company all around the world. We deeply believe that our good service and experience will completely meet your needs. Integrality, value and innovation are the forces that drive our success.



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